PROBE TIPS CLEANING PADS

During the process of probing the probe tip can often pick up foreign particles or debris that get attached to the bottom of the probe tip. The foreign material often negatively impacts the electrical performance of the probe tip causing test data obtained to be false – lower or higher in value than actual. Materials could be metals, oxide, dust particles, human hair, skin flakes and more.

SemiProbe provides probe tip cleaning materials. The small pads get affixed to the standard wafer chuck or to an auxiliary pad of a High Frequency chuck via vacuum. The probe tip can be indexed manually or automatically in and out of contact on the cleaning pad. This often removes the foreign particles. Prior to contacting the device the probe tip can carefully be cleaned via a can of air or isopropyl alcohol with a lint free swap.